Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-HDAF-11-08.0-S-13-2 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
| Series | HD Mezz™ HDAF | |
| Packaging | Tray | |
| Connector Type | High Density Array, Female | |
| Number of Positions | 143 | |
| Pitch | 0.047" (1.20mm) | |
| Number of Rows | 13 | |
| Mounting Type | Surface Mount | |
| Features | Board Guide | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 30µin (0.76µm) | |
| Mated Stacking Heights | 20mm, 25mm | |
| Height Above Board | 0.414" (10.51mm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | HDAF-11-08.0-S-13-2 | |
| Related Links | HDAF-11-0, HDAF-11-08.0-S-13-2 Datasheet, Samtec, Inc. Distributor | |
![]() | XC3S250E-4PQG208C | IC FPGA 158 I/O 208PQFP | datasheet.pdf | |
![]() | RMC07DRTN | CONN EDGECARD 14POS DIP .100 SLD | datasheet.pdf | |
![]() | 1622685-1 | RES 130 OHM 3/4W 1% AXIAL | datasheet.pdf | |
![]() | MMB21-0091J1 | CONN RACK/PANEL 9POS 5A | datasheet.pdf | |
![]() | KPSE07E10-6SDN | CONN RCPT 6POS JAM NUT W/SKTS | datasheet.pdf | |
![]() | RNC50H2461DSBSL | RES 2.46K OHM 1/10W .5% AXIAL | datasheet.pdf | |
![]() | 483-V533-J3M1-C4S0ZN-20A | CIR BRKR THRM 20A 115VAC 28VDC | datasheet.pdf | |
![]() | R3J2K0 | RES 2K OHM 3W 5% RADIAL | datasheet.pdf | |
![]() | NNC75X75WH2 | WIRE DUCT SLOTTED | datasheet.pdf | |
![]() | W972GG8JB-3I TR | 2G DDR2-800 X8. IND | datasheet.pdf | |
![]() | TVS07RF-19-28BB | TV 28C 26#20 2#16 SKT J/N RECP | datasheet.pdf | |
![]() | 97-3100A36-10PX | AB 48C 48#16 PIN RECP | datasheet.pdf |