Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-HDAM-23-17.0-S-13-1 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
| Series | HD Mezz™ HDAM | |
| Packaging | Tray | |
| Connector Type | High Density Array, Male | |
| Number of Positions | 299 | |
| Pitch | 0.047" (1.20mm) | |
| Number of Rows | 13 | |
| Mounting Type | Surface Mount | |
| Features | Board Guide | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 30µin (0.76µm) | |
| Mated Stacking Heights | 25mm, 35mm | |
| Height Above Board | 0.880" (22.35mm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | HDAM-23-17.0-S-13-1 | |
| Related Links | HDAM-23-1, HDAM-23-17.0-S-13-1 Datasheet, Samtec, Inc. Distributor | |
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