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Bergquist HF115AC-0.0055-AC-105

HF115AC-0.0055-AC-105 picture photo
Mfg. Part Number
HF115AC-0.0055-AC-105
Manufacturer
Product Category
Thermal - Pads, Sheets
Brief Description
THERM PAD SIP PKG W/ADH HI-FLOW
Datasheet Download
HF115AC-0.0055-AC-105.pdf
Availability of HF115AC-0.0055-AC-105

Available Quantity

5020 Pieces

Can ship today

Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
$ 0.05460
Our Price
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QUANTITY

 

EIS Components is the stocking Distributor of HF115AC-0.0055-AC-105, we specialize in Bergquist all series electronic components. HF115AC-0.0055-AC-105 can be shipped within 24 hours after order. If you have any demands for HF115AC-0.0055-AC-105, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
HF115AC-0.0055-AC-105 Order Process
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Specifications of HF115AC-0.0055-AC-105
Internal Part NumberEIS-HF115AC-0.0055-AC-105
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)
Production Status (Lifecycle)In Production
ConditionNew & Unused, Original Sealed
Other Related DocumentsSil-Pad Metric Configurations
RoHS InformationHi-Flow 115-AC Material Report
Standard Package100
Category Fans, Thermal Management
FamilyThermal - Pads, Sheets
SeriesHi-Flow® 115-AC
UsageSIP
ShapeRectangle
Outline36.83mm x 21.29mm
Thickness0.0055" (0.140mm)
MaterialPhase Change Compound
AdhesiveAdhesive - One Side
Backing, CarrierFiberglass
ColorGray
Thermal Resistivity0.35°C/W
Thermal Conductivity0.8 W/m-K
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)HF115AC-0.0055-AC-105
Related LinksHF115AC-0., HF115AC-0.0055-AC-105 Datasheet, Bergquist Distributor
HF115AC-0.0055-AC-105 Details Description
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