Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-HM2P07PDJ3N5N9LF | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | HM2 Series Copper Alloy 22/Jun/2013 | |
| Standard Package | 1,152 | |
| Category | Connectors, Interconnects | |
| Family | Backplane Connectors - Hard Metric, Standard | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | HM2P07PDJ3N5N9LF | |
| Related Links | HM2P07PD, HM2P07PDJ3N5N9LF Datasheet, FFF Distributor | |
![]() | S2EB-L2-24V | RELAY GEN PURPOSE 4PST 4A 24V | datasheet.pdf | |
![]() | RSC30DRYI-S734 | CONN EDGECARD 60POS DIP .100 SLD | datasheet.pdf | |
![]() | KPTC6F22-55PXDMB | CONN PLUG 55POS INLINE PIN | datasheet.pdf | |
![]() | RNC50H6491FSRSL | RES 6.49K OHM 1/10W 1% AXIAL | datasheet.pdf | |
![]() | 1457KEP-10 | EMI/RFI END PANELS 10/PACK | datasheet.pdf | |
![]() | ABM08DRYS-S13 | CONN EDGECARD 16POS .156" | datasheet.pdf | |
![]() | ATS-01C-51-C1-R0 | HEATSINK 30X30X20MM L-TAB | datasheet.pdf | |
![]() | TJE120942 | SERIES I, ELECTRONIC MODULE | datasheet.pdf | |
![]() | MDM-37SH044K | MICRO 37C S 18" WHT JACKS | datasheet.pdf | |
![]() | 2902659 | FL MC EF WDM-B SC | datasheet.pdf | |
| AP1159ADS09 | IC REG LDO 14VIN 100MA SOT23-5 | datasheet.pdf | ||
![]() | GRM155R72A472K | Chip Monolithic Ceramic Capacitor 0402 X7R 4.7nF 100V | datasheet.pdf |