Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-HM2P09PDP291N9L | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | Millipacs Header & Receptacle 13/Feb/2014 | |
| PCN Design/Specification | HM2 Series Copper Alloy 22/Jun/2013 | |
| Standard Package | 1,152 | |
| Category | Connectors, Interconnects | |
| Family | Backplane Connectors - Hard Metric, Standard | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | HM2P09PDP291N9L | |
| Related Links | HM2P09P, HM2P09PDP291N9L Datasheet, FFF Distributor | |
![]() | TSW-144-23-L-S | CONN HEADER 44POS .100" SGL GOLD | datasheet.pdf | |
![]() | 1812AC102JAT1A | CAP CER 1000PF 1KV X7R 1812 | datasheet.pdf | |
![]() | TNPW0805820KBETA | RES SMD 820K OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | RNC50H3240BSRE6 | RES 324 OHM 1/10W .1% AXIAL | datasheet.pdf | |
![]() | RN70C1332FRSL | RES 13.3K OHM 3/4W 1% AXIAL | datasheet.pdf | |
![]() | 1626-3-5A | CIR BRKR THRM 5A 24VDC PUSH-PUSH | datasheet.pdf | |
![]() | 5ASXBB5D6F35C6N | IC FPGA 350 I/O 1152FBGA | datasheet.pdf | |
![]() | 09670159064 | MIN D FE 15P WRAP POPC PL3_REMOV | datasheet.pdf | |
![]() | 8N3QV01FG-1030CDI | IC OSC VCXO QD FREQ 10CLCC | datasheet.pdf | |
![]() | TTC20T-2.5 | THERMTRANS COMP LABEL ADH TEDLAR | datasheet.pdf | |
![]() | ATS-06B-94-C3-R0 | HEATSINK 40X40X25MM R-TAB T412 | datasheet.pdf | |
![]() | IPA-11-1REC4-61-6.00-01 | CIR BRKR MAG-HYDR LEVER 6A | datasheet.pdf |