Hittite (Analog Devices) HMC-C007

HMC-C007 picture photo
Mfg. Part Number
HMC-C007
Manufacturer
Product Category
RF Misc ICs and Modules
Brief Description
INGAP HBT DIVIDE-BY-8 MODULE 0.5
Datasheet Download
HMC-C007.pdf
Availability of HMC-C007

Available Quantity

5020 Pieces

Can ship today


Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
$ 1.00000
Our Price
Quote by Email

QUANTITY

 

EIS Components is the stocking Distributor of HMC-C007, we specialize in Hittite (Analog Devices) all series electronic components. HMC-C007 can be shipped within 24 hours after order. If you have any demands for HMC-C007, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
HMC-C007 Order Process
Add Parts to RFQ form
Submit RFQ
We reply within 24 hours
You confirm order
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Specifications of HMC-C007
Internal Part NumberEIS-HMC-C007
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)1 (Unlimited)
Production Status (Lifecycle)In Production
ConditionNew & Unused, Original Sealed
Standard Package1
Category RF/IF and RFID
FamilyRF Misc ICs and Modules
Series-
PackagingBulk
FunctionDivide-by-8
Frequency500MHz ~ 18GHz
RF TypeVSAT
Secondary Attributes-
Package / CaseModule, SMA Connectors
Supplier Device PackageModule
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)HMC-C007
Related LinksHMC-, HMC-C007 Datasheet, Hittite (Analog Devices) Distributor
HMC-C007 Details Description
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