Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-HMC17DREN | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | ||
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Card Edge Connectors - Edgeboard Connectors | |
Series | - | |
Packaging | Tube | |
Card Type | Non Specified - Dual Edge | |
Gender | Female | |
Number of Positions/Bay/Row | 17 | |
Number of Positions | 34 | |
Card Thickness | 0.062" (1.57mm) | |
Number of Rows | 2 | |
Pitch | 0.100" (2.54mm) | |
Features | - | |
Mounting Type | Free Hanging (In-Line) | |
Termination | Solder Eyelet(s) | |
Contact Material | Beryllium Copper | |
Contact Finish | Gold | |
Contact Finish Thickness | 30µin (0.76µm) | |
Contact Type | Full Bellows | |
Color | Blue | |
Flange Feature | - | |
Operating Temperature | -65°C ~ 125°C | |
Material - Insulation | Polybutylene Terephthalate (PBT) | |
Read Out | Dual | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | HMC17DREN | |
Related Links | HMC1, HMC17DREN Datasheet, Sullins Connector Solutions Distributor |
![]() | ED114/3DS | TERMINAL BLOCK 7.50MM VERT 3POS | datasheet.pdf | |
![]() | RT0402DRE0727RL | RES SMD 27 OHM 0.5% 1/16W 0402 | datasheet.pdf | |
![]() | 57PC5FS | CONN RCPT 5CONT DIN R/A PCB SHLD | datasheet.pdf | |
![]() | MCP200JR-330R | RES SMD 330 OHM 5% 2W MELF | datasheet.pdf | |
![]() | FAD1-06025CHLW12 | FAN AXIAL 60X25MM 12VDC WIRE | datasheet.pdf | |
![]() | RN55E3090BB14 | RES 309 OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | XPEBWT-P1-R250-006Z8 | LED XLAMP WARM WHITE 2700K 2SMD | datasheet.pdf | |
![]() | NTHS0805N01N2202JR | THERMISTOR NTC 22K OHM 5% 0805 | datasheet.pdf | |
![]() | 612-83-320-41-001101 | CONN IC DIP SOCKET 20POS GOLD | datasheet.pdf | |
![]() | IS61NLP102418B-200B3L-TR | IC SRAM 18MB 200MHZ 165BGA | datasheet.pdf | |
HMC-C007 | INGAP HBT DIVIDE-BY-8 MODULE 0.5 | datasheet.pdf | ||
![]() | CN0967C14A03PN-040 | 26500 3C 2#16 1#2 P RECP AN LC | datasheet.pdf |