Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-HSTT75-QC | |
Lead Free Status / RoHS Status | ||
Moisture Sensitivity Level (MSL) | ||
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
MSDS Material Safety Datasheet | HSTT,HSTTA,HSTTV, HSTTVA Series MSDS | |
Standard Package | 1 | |
Category | Cables, Wires - Management | |
Family | Heat Shrink Tubing | |
Series | HSTT | |
Type | Tubing, Flexible | |
Shrinkage Ratio | 2 to 1 | |
Length | 25.0' (7.62m) | |
Inner Diameter - Supplied | 0.750" (19.0mm) | |
Inner Diameter - Recovered | 0.375" (9.5mm) | |
Recovered Wall Thickness | 0.030" (0.76mm) | |
Material | Polyolefin (PO) | |
Features | - | |
Color | Clear | |
Operating Temperature | -55°C ~ 135°C | |
Shrink Temperature | - | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | HSTT75-QC | |
Related Links | HSTT, HSTT75-QC Datasheet, Panduit Distributor |
![]() | RC0603FR-07649RL | RES SMD 649 OHM 1% 1/10W 0603 | datasheet.pdf | |
![]() | GCC31DCMI | CONN EDGECARD 62POS .100" WW | datasheet.pdf | |
![]() | 381LX562M050A022 | CAP ALUM 5600UF 20% 50V SNAP | datasheet.pdf | |
![]() | ESR10EZPJ223 | RES SMD 22K OHM 5% 0.4W 0805 | datasheet.pdf | |
![]() | 74SSTL16857DGGRG4 | IC SSTL2 REGISTERED BUFF 48TSSOP | datasheet.pdf | |
![]() | A42MX09-VQ100I | IC FPGA 83 I/O 100VQFP | datasheet.pdf | |
![]() | 0027664105 | KK 156 HDR FRLK PEG 10POS TIN | datasheet.pdf | |
![]() | TNM2.5-6.5-25-1 | ROUND STANDOFF M2.5 NYLON 25MM | datasheet.pdf | |
![]() | AMC18DTBS | CONN EDGECARD 36POS .100" | datasheet.pdf | |
![]() | ATS-15F-167-C3-R0 | HEATSINK 25X25X20MM R-TAB T412 | datasheet.pdf | |
![]() | E2A-M18KS08WSHI1M | MODIFIED E2A FOR HARDI INT | datasheet.pdf | |
![]() | MS27497T18B35B | JT 66C 66#22D SKT WALL RECP | datasheet.pdf |