Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-IDT71V67603S150PFI | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 72 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Synchronous | |
| Memory Size | 9M (256K x 36) | |
| Speed | 150MHz | |
| Interface | Parallel | |
| Voltage - Supply | 3.135 V ~ 3.465 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 100-LQFP | |
| Supplier Device Package | 100-TQFP (14x14) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | IDT71V67603S150PFI | |
| Related Links | IDT71V676, IDT71V67603S150PFI Datasheet, Integrated Device Technology (IDT) Distributor | |
![]() | 0315.100H | FUSE GLASS 100MA 250VAC 3AB 3AG | datasheet.pdf | |
![]() | 644083-3 | CONN RECEPT 3POS POL MTA-100 TIN | datasheet.pdf | |
![]() | HCM11DSAI | CONN EDGECARD 22POS R/A .156 SLD | datasheet.pdf | |
![]() | 320.03E11.094BLK | SWITCH TACT SPST-NO 0.025A 50V | datasheet.pdf | |
![]() | C0805C682K1RACTU | CAP CER 6800PF 100V X7R 0805 | datasheet.pdf | |
![]() | RNC50J3971BSB14 | RES 3.97K OHM 1/10W .1% AXIAL | datasheet.pdf | |
![]() | 3001 01510001 | NON-HERMETIC THERMOSTAT | datasheet.pdf | |
![]() | 98000341788 | FOAM INSERTS, M2467PW | datasheet.pdf | |
![]() | ATS-11G-19-C2-R0 | HEATSINK 54X54X20MM XCUT T766 | datasheet.pdf | |
![]() | VJ0805D471KXXAR | CAP CER 470PF 25V NP0 0805 | datasheet.pdf | |
![]() | 3032570 | FBS 3-8 BU | datasheet.pdf | |
![]() | MS24264R8B3S9-LC | 26500 3C 3#20 SKT RECP | datasheet.pdf |