Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-IRF1018ESTRLPBF | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | High Voltage Integrated Circuits (HVIC Gate Drivers) | |
| PCN Design/Specification | Copper Plating Update 31/Aug/2015 Material Chg 24/Nov/2015 | |
| PCN Assembly/Origin | Mosfet Backend Wafer Processing 23/Oct/2013 Warehouse Transfer 29/Jul/2015 | |
| PCN Packaging | Package Drawing Update 19/Aug/2015 | |
| Standard Package | 800 | |
| Category | Discrete Semiconductor Products | |
| Family | FETs - Single | |
| Series | HEXFET® | |
| Packaging | Tape & Reel (TR) | |
| FET Type | MOSFET N-Channel, Metal Oxide | |
| FET Feature | Standard | |
| Drain to Source Voltage (Vdss) | 60V | |
| Current - Continuous Drain (Id) @ 25°C | 79A (Tc) | |
| Rds On (Max) @ Id, Vgs | 8.4 mOhm @ 47A, 10V | |
| Vgs(th) (Max) @ Id | 4V @ 100µA | |
| Gate Charge (Qg) @ Vgs | 69nC @ 10V | |
| Input Capacitance (Ciss) @ Vds | 2290pF @ 50V | |
| Power - Max | 110W | |
| Mounting Type | Surface Mount | |
| Package / Case | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | |
| Supplier Device Package | D2PAK | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | IRF1018ESTRLPBF | |
| Related Links | IRF1018, IRF1018ESTRLPBF Datasheet, International Rectifier (Infineon Technologies Americas Corp.) Distributor | |
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