Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-IS61NLP25636A-200B3I-TR | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 2 (1 Year) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 2,000 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Synchronous | |
| Memory Size | 9M (256K x 36) | |
| Speed | 200MHz | |
| Interface | Parallel | |
| Voltage - Supply | 3.135 V ~ 3.465 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 165-TFBGA | |
| Supplier Device Package | 165-TFBGA (13x15) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | IS61NLP25636A-200B3I-TR | |
| Related Links | IS61NLP2563, IS61NLP25636A-200B3I-TR Datasheet, ISSI, Integrated Silicon Solution Inc Distributor | |
![]() | PTKM100-30SM | FIXED IND 100UH 1.5A 150 MOHM | datasheet.pdf | |
![]() | RG3216N-1582-C-T5 | RES SMD 15.8KOHM 0.25% 1/4W 1206 | datasheet.pdf | |
![]() | HCM15DRTN | CONN EDGECARD 30POS DIP .156 SLD | datasheet.pdf | |
![]() | D55342E07B4B07RWS | RES SMD 4.07K OHM 0.1% 1/4W 1206 | datasheet.pdf | |
![]() | MI-J64-MA | CONVERT DC/DC 270VIN 48VOUT 10W | datasheet.pdf | |
![]() | MI-27W-MW-S | CONVRT DC/DC 165VIN 5.5VOUT 100W | datasheet.pdf | |
![]() | CX3225GB18432D0HPQCC | Crystal 18.4320MHz 20ppm 8pF 80 Ohm -40°C - 85°C Surface Mount 4-SMD, No Lead (DFN, LCC) | datasheet.pdf | |
![]() | 5603125 | CONN TERM BLOCK | datasheet.pdf | |
![]() | ATS-19F-56-C2-R0 | HEATSINK 35X35X15MM L-TAB T766 | datasheet.pdf | |
![]() | MAL211080602E3 | CAP ALUM 6000UF 300V SCREW | datasheet.pdf | |
![]() | JMK042BJ222KC-W | CAP CER 2200PF 6.3V X5R 01005 | datasheet.pdf | |
![]() | SIT9002AI-33H25DX | OSC MEMS PROG | datasheet.pdf |