Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-IS61NLP25636A-200B3LI | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 2 (1 Year) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 144 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Synchronous | |
| Memory Size | 9M (256K x 36) | |
| Speed | 200MHz | |
| Interface | Parallel | |
| Voltage - Supply | 3.135 V ~ 3.465 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 165-TFBGA | |
| Supplier Device Package | 165-TFBGA (13x15) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | IS61NLP25636A-200B3LI | |
| Related Links | IS61NLP256, IS61NLP25636A-200B3LI Datasheet, ISSI, Integrated Silicon Solution Inc Distributor | |
![]() | 7440690150 | FIXED IND 15UH 1.25A 200 MOHM | datasheet.pdf | |
![]() | VI-BVR-MX-F2 | CONVERTER MOD DC/DC 7.5V 75W | datasheet.pdf | |
![]() | RNR60J1131BRB14 | RES 1.13K OHM 1/4W .1% AXIAL | datasheet.pdf | |
![]() | RN65E6810CBSL | RES 681 OHM 1/2W .25% AXIAL | datasheet.pdf | |
![]() | ATS-17A-48-C1-R0 | HEATSINK 25X25X35MM L-TAB | datasheet.pdf | |
![]() | ATS-12B-169-C1-R0 | HEATSINK 30X30X10MM R-TAB | datasheet.pdf | |
![]() | ATS-13B-175-C3-R0 | HEATSINK 35X35X10MM R-TAB T412 | datasheet.pdf | |
![]() | 10-214622-18P | CONN PLUG 8POS INLINE PIN | datasheet.pdf | |
![]() | UPA0J152MPD1TA | CAP ALUM 1500UF 20% 6.3V RADIAL | datasheet.pdf | |
![]() | CTVP00RF-15-55PB-P3AD | HD 38999 55C 55#23 PIN RECP | datasheet.pdf | |
![]() | TV07DZ-25-90PC-LC | TV 46C MIXED PIN J/N RECP | datasheet.pdf | |
![]() | PZ5128NS15BE-S | EE PLD, 17.5ns, 128-Cell, CMOS, PQFP128 IC | datasheet.pdf |