Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-JMBADGE2008 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Standard Package | 1 | |
| Category | Programmers, Development Systems | |
| Family | Evaluation Boards - Embedded - MCU, DSP | |
| Series | ColdFire®, Flexis™ | |
| Board Type | Evaluation Platform | |
| Type | MCU 32-Bit | |
| Core Processor | Coldfire V1 | |
| Operating System | - | |
| Platform | - | |
| For Use With/Related Products | MCF51JM128 | |
| Mounting Type | Fixed | |
| Contents | Board(s), Cable(s) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | JMBADGE2008 | |
| Related Links | JMBAD, JMBADGE2008 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
![]() | LT1711CMS8#PBF | IC COMP R-RINOUT SINGLE 8-MSOP | datasheet.pdf | |
![]() | PIC16C55-LP/SO | IC MCU 8BIT 768B OTP 28SOIC | datasheet.pdf | |
![]() | MCP23008T-E/ML | IC I/O EXPANDER I2C 8B 20QFN | datasheet.pdf | |
![]() | TNPW0805576RBEEN | RES SMD 576 OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | 1669712 | CABLE 3POS M8 SOCKET-WIRE 1.5M | datasheet.pdf | |
![]() | RWR89N15R0FRBSL | RES 15 OHM 3W 1% WW AXIAL | datasheet.pdf | |
![]() | M39003/01-3172H | CAP TANT 0.18UF 10% 100V AXIAL | datasheet.pdf | |
![]() | M55342E06B18B2RWI | RES SMD 18.2KOHM 0.1% 0.15W 0805 | datasheet.pdf | |
![]() | M55342H12B4E22RT5 | RES SMD 4.22K OHM 1% 1/10W 0603 | datasheet.pdf | |
![]() | SIT1602ACB7-18S | OSC MEMS PROG 2.0X1.6MM 1.8V | datasheet.pdf | |
![]() | 466606-1 | HDM STEAPR110F K | datasheet.pdf | |
![]() | BFC246843393 | CAP FILM 39NF 5% 630VDC RAD | datasheet.pdf |