Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-KIT-13197 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Video File | XBees Soar into Space on NASA Rocket | |
| Software Download | XBee Shield Eagle Files XBee Explorer USB Eagle Files | |
| Design Resources | XBee Shield Schematic Xbee Explorer USB Schematic Development Tool Selector | |
| Standard Package | 1 | |
| Category | RF/IF and RFID | |
| Family | RF Evaluation and Development Kits, Boards | |
| Series | XBee® | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | KIT-13197 | |
| Related Links | KIT-, KIT-13197 Datasheet, SparkFun Electronics Distributor | |
![]() | ERJ-6ENF3402V | RES SMD 34K OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | P87C52SBPN,112 | IC 80C51 MCU 8K OTP 40-DIP IN STOCK SHIP TODAY | datasheet.pdf | |
![]() | TSW-128-07-T-D | CONN HEADER 56POS .100" DL TIN | datasheet.pdf | |
![]() | TSW-116-26-S-S | CONN HEADER 16POS .100" SGL GOLD | datasheet.pdf | |
![]() | ATS-55330K-C0-R0 | HEATSINK 33X33X14.5MM W/OUT TIM | datasheet.pdf | |
![]() | MMB21-020 | CONN RACK/PANEL 20POS 5A | datasheet.pdf | |
![]() | RN55C3000FRE6 | RES 300 OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | MI-22W-MX-F2 | CONVERT DC/DC 28VIN 5.5VOUT 75W | datasheet.pdf | |
| 501ACA-ABAG | OSC PROG 0.7NS 20PPM 3.2X5MM | datasheet.pdf | ||
![]() | ATS-08F-169-C1-R0 | HEATSINK 30X30X10MM R-TAB | datasheet.pdf | |
![]() | 1385411-1 | HDM 8SMPO076F LM | datasheet.pdf | |
![]() | XC1764-PC20C | Configuration Memory, 64KX1, CMOS, PQCC20 IC | datasheet.pdf |