Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-LAPIS DEVELOPMENT KIT | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Standard Package | 15 | |
| Category | Programmers, Development Systems | |
| Family | Evaluation Boards - Embedded - MCU, DSP | |
| Series | Lapis | |
| Board Type | Evaluation Platform | |
| Type | MCU 8-Bit | |
| Core Processor | nX-U8/100 | |
| Operating System | - | |
| Platform | - | |
| For Use With/Related Products | ML610Q | |
| Mounting Type | Fixed | |
| Contents | Board(s) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | LAPIS DEVELOPMENT KIT | |
| Related Links | LAPIS DEVE, LAPIS DEVELOPMENT KIT Datasheet, Rohm Semiconductor Distributor | |
![]() | 7361 | SPACER MOUNTS LED T-1 .300" | datasheet.pdf | |
![]() | 10SST120 | RELAY SOFTSTART 10A 120VAC ACOUT | datasheet.pdf | |
![]() | BC638 | TRANS PNP 60V 1A TO-92 | datasheet.pdf | |
![]() | ERJ-S14F2743U | RES SMD 274K OHM 1% 1/2W 1210 | datasheet.pdf | |
![]() | 84806 | PROTECTION FILM 6" X 40 YDS | datasheet.pdf | |
![]() | CG3-160E/12 | CARD GUIDE 160MM ESD CLIP 12PCS | datasheet.pdf | |
![]() | 1.5KE180CAHE3/54 | TVS DIODE 154VWM 246VC 1.5KE | datasheet.pdf | |
![]() | 644740-1 | CONN HEADER 9POS VERT .156 TIN | datasheet.pdf | |
![]() | RN55E2550BRE6 | RES 255 OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | 2EZ200D5E3/TR8 | DIODE ZENER 200V 2W DO204AL | datasheet.pdf | |
![]() | V72C36C150BN3 | CONVERTER MOD DC/DC 36V 150W | datasheet.pdf | |
![]() | NOIV1SN016KA-GDI | IC IMAGE SENSOR 16MP 355PGA | datasheet.pdf |