Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-LFSC3GA25E-7F900C | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Obsolescence/ EOL | Tin/Lead Devices 23/Jun/2015 | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 27 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | SC | |
Number of LABs/CLBs | 6250 | |
Number of Logic Elements/Cells | 25000 | |
Total RAM Bits | 1966080 | |
Number of I/O | 378 | |
Number of Gates | - | |
Voltage - Supply | 0.95 V ~ 1.26 V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C | |
Package / Case | 900-BBGA | |
Supplier Device Package | 900-FPBGA (31x31) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | LFSC3GA25E-7F900C | |
Related Links | LFSC3GA2, LFSC3GA25E-7F900C Datasheet, Lattice Semiconductor Corporation Distributor |
![]() | LTC1276ACN#PBF | IC A/D CONV 12BIT SAMPLING 24DIP | datasheet.pdf | |
![]() | 4816P-T01-564LF | RES ARRAY 8 RES 560K OHM 16SOIC | datasheet.pdf | |
![]() | CD74HC237PWE4 | IC DECODER/DEMUX HS 3-8 16TSSOP | datasheet.pdf | |
![]() | CD4007UBEE4 | IC DUAL COMPL PAIR W/INV 14-DIP | datasheet.pdf | |
SLP103M063H9P3 | CAP ALUM 10000UF 20% 63V SNAP | datasheet.pdf | ||
![]() | MS27484E18F96S | CONN PLUG 9POS STRAIGHT W/SCKT | datasheet.pdf | |
![]() | 202D285-12-0 | BOOT MOLDED | datasheet.pdf | |
![]() | MCS04020D1371BE100 | RES SMD 1.37KOHM 0.1% 1/16W 0402 | datasheet.pdf | |
![]() | RNC55J43R7BSB14 | RES 43.7 OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | ELXM251VSN561MR35S | CAP ALUM 560UF 20% 250V SNAP | datasheet.pdf | |
![]() | 0011325495 | FILTER ELEMENT | datasheet.pdf | |
![]() | TV07DZ-15-97A | TV 12C 8#20 4#16 PIN J/N RECP | datasheet.pdf |