Ship from: HONGKONG
								Date Code: Newest Date Code
								Manufacturer lead time 6 weeks
| Internal Part Number | EIS-LFX200EB-03FN256C | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | Tin/Lead Devices 23/Jun/2015 | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ispXPGA® | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | 2704 | |
| Total RAM Bits | 113664 | |
| Number of I/O | 160 | |
| Number of Gates | 210000 | |
| Voltage - Supply | 2.3 V ~ 3.6 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 256-BGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | LFX200EB-03FN256C | |
| Related Links | LFX200EB, LFX200EB-03FN256C Datasheet, Lattice Semiconductor Corporation Distributor | |
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