Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-LFXP2-30E-6FN672C | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Multiple Devices Cu Wire 01/Jul/2013 | |
| PCN Assembly/Origin | Alternate Qualified Test Site 30/Sep/2013 Alternate Assembly Revision B 17/Nov/2014 Alternate Assembly/Test Site 14/Apr/2014 | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | XP2 | |
| Number of LABs/CLBs | 3625 | |
| Number of Logic Elements/Cells | 29000 | |
| Total RAM Bits | 396288 | |
| Number of I/O | 472 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 1.26 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 672-BBGA | |
| Supplier Device Package | 672-FPBGA (27x27) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | LFXP2-30E-6FN672C | |
| Related Links | LFXP2-30, LFXP2-30E-6FN672C Datasheet, Lattice Semiconductor Corporation Distributor | |
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