Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-LFXP2-30E-6FTN256C | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Devices Cu Wire 01/Jul/2013 | |
PCN Assembly/Origin | Alternate Qualified Test Site 30/Sep/2013 Alternate Assembly Revision B 17/Nov/2014 Alternate Assembly/Test Site 06/Oct/2014 Alternate Assembly Revision B 17/Nov/2014 Alternate Assembly/Test Site 14/Apr/2014 | |
Standard Package | 90 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | XP2 | |
Number of LABs/CLBs | 3625 | |
Number of Logic Elements/Cells | 29000 | |
Total RAM Bits | 396288 | |
Number of I/O | 201 | |
Number of Gates | - | |
Voltage - Supply | 1.14 V ~ 1.26 V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C | |
Package / Case | 256-LBGA | |
Supplier Device Package | 256-FTBGA (17x17) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | LFXP2-30E-6FTN256C | |
Related Links | LFXP2-30E, LFXP2-30E-6FTN256C Datasheet, Lattice Semiconductor Corporation Distributor |
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