Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-LIB-WIN-SA-F-INCR | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Standard Package | 1 | |
| Category | Programmers, Development Systems | |
| Family | Software, Services | |
| Series | - | |
| Type | License | |
| Applications | - | |
| Edition | - | |
| License Length | - | |
| License - User Details | - | |
| Operating System | - | |
| For Use With/Related Products | Microsemi Devices | |
| Media Delivery Type | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | LIB-WIN-SA-F-INCR | |
| Related Links | LIB-WIN-, LIB-WIN-SA-F-INCR Datasheet, Microsemi SoC Distributor | |
![]() | 73636 | ESD LAB COAT W/CUFFS WHITE 3XL | datasheet.pdf | |
![]() | 3640AA103KAT3A | CAP CER 10000PF 1KV NP0 3640 | datasheet.pdf | |
![]() | CY14B101K-SP45XCT | IC NVSRAM 1MBIT 45NS 48SSOP | datasheet.pdf | |
![]() | CSRN2512FT68L0 | RES SMD 0.068 OHM 1% 2W 2512 | datasheet.pdf | |
![]() | RN55C2804FB14 | RES 2.8M OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | ATS-11H-95-C2-R0 | HEATSINK 40X40X30MM R-TAB T766 | datasheet.pdf | |
![]() | ATS-11C-56-C2-R0 | HEATSINK 35X35X15MM L-TAB T766 | datasheet.pdf | |
![]() | 265101-08-06.00 | MMCX PLG TO PL RG 178 | datasheet.pdf | |
![]() | VX161100B0J0G | 350 TB SOC VER CLOSE THR | datasheet.pdf | |
![]() | SIT3807AI-G-18EE | OSC MEMS PROG 2.5X2.0MM 1.8V | datasheet.pdf | |
![]() | 2217483-1 | KIT, BTLI, DOUBLE ACTION HEAD | datasheet.pdf | |
![]() | D38999/20JJ61AC | CONN HSG RCPT FLANGE 61POS PIN | datasheet.pdf |