Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-LM3S9DN6-IBZ80-A1 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Standard Package | 184 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | Stellaris® ARM® Cortex®-M3S 9000 | |
| Packaging | Tray | |
| Core Processor | ARM® Cortex®-M3 | |
| Core Size | 32-Bit | |
| Speed | 80MHz | |
| Connectivity | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, Microwire, QEI, SPI, SSI, UART/USART, USB OTG | |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | |
| Number of I/O | 72 | |
| Program Memory Size | 512KB (512K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 96K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.235 V ~ 1.365 V | |
| Data Converters | A/D 16x12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 108-LFBGA | |
| Supplier Device Package | 108-BGA (10x10) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | LM3S9DN6-IBZ80-A1 | |
| Related Links | LM3S9DN6, LM3S9DN6-IBZ80-A1 Datasheet, Texas Instruments Distributor | |
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