Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-LM810M3-4.63 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 1,000 | |
| Category | Integrated Circuits (ICs) | |
| Family | PMIC - Supervisors | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Type | Simple Reset/Power-On Reset | |
| Number of Voltages Monitored | 1 | |
| Output | Push-Pull, Totem Pole | |
| Reset | Active High | |
| Reset Timeout | 140 ms Minimum | |
| Voltage - Threshold | 4.63V | |
| Operating Temperature | -40°C ~ 105°C | |
| Mounting Type | Surface Mount | |
| Package / Case | TO-236-3, SC-59, SOT-23-3 | |
| Supplier Device Package | SOT-23-3 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | LM810M3-4.63 | |
| Related Links | LM810M, LM810M3-4.63 Datasheet, Texas Instruments Distributor | |
![]() | LT1137ACNW | IC 3DRV/5RCV RS232 5V 28-DIP | datasheet.pdf | |
![]() | HST1.1-6-X2 | HEAT SHRINK THICK ADH RED 1.1X6" | datasheet.pdf | |
![]() | AMC25DRTF | CONN EDGECARD 50POS .100 DIP SLD | datasheet.pdf | |
![]() | CY62136FV30LL-55ZSXE | IC SRAM 2MBIT 55NS 44TSOP | datasheet.pdf | |
![]() | AEB686M2CU44T-F | CAP ALUM 68UF 20% 160V SMD | datasheet.pdf | |
![]() | 70V05L20PF | IC SRAM 64KBIT 20NS 64TQFP | datasheet.pdf | |
![]() | VI-J3J-CX-F2 | CONVERTER MOD DC/DC 36V 75W | datasheet.pdf | |
![]() | PF2205-0R39F1 | RES 0.39 OHM 50W 1% TO220 | datasheet.pdf | |
![]() | 13008-060KESA/HR | CAP TANT 47UF 35V 10% 2917 | datasheet.pdf | |
![]() | Y0062374R000B9L | RES 374 OHM 0.6W 0.1% RADIAL | datasheet.pdf | |
![]() | ATS-07G-87-C1-R0 | HEATSINK 35X35X20MM R-TAB | datasheet.pdf | |
![]() | MDM-21PH059P | MICRO 21C P 72" WHT JACKP | datasheet.pdf |