Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-LMC8101TP/NOPB | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | ESD Protection Basics | |
| Featured Product | Create your power design now with TI’s WEBENCH® Designer | |
| PCN Assembly/Origin | Wafer Process BCB Elimnation 12/Feb/2014 Wafer Process Revision A 14/Jul/2014 | |
| PCN Packaging | Carrier Tape Update 24/Aug/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 250 | |
| Category | Integrated Circuits (ICs) | |
| Family | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Amplifier Type | General Purpose | |
| Number of Circuits | 1 | |
| Output Type | Rail-to-Rail | |
| Slew Rate | 1.2 V/µs | |
| Gain Bandwidth Product | 1.3MHz | |
| -3db Bandwidth | - | |
| Current - Input Bias | 1pA | |
| Voltage - Input Offset | 700µV | |
| Current - Supply | 1.1mA | |
| Current - Output / Channel | 90mA | |
| Voltage - Supply, Single/Dual (±) | 2.7 V ~ 10 V, ±1.35 V ~ 5 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-UFBGA | |
| Supplier Device Package | 8-microSMD | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | LMC8101TP/NOPB | |
| Related Links | LMC8101, LMC8101TP/NOPB Datasheet, Texas Instruments Distributor | |
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