Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-LMP2011MA | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Featured Product | Create your power design now with TI’s WEBENCH® Designer | |
| PCN Design/Specification | SOIC Pkg Wire Bonding 20/Mar/2013 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 95 | |
| Category | Integrated Circuits (ICs) | |
| Family | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps | |
| Series | LMP® | |
| Packaging | Tube | |
| Amplifier Type | General Purpose | |
| Number of Circuits | 1 | |
| Output Type | Rail-to-Rail | |
| Slew Rate | 4 V/µs | |
| Gain Bandwidth Product | 3MHz | |
| -3db Bandwidth | - | |
| Current - Input Bias | 3pA | |
| Voltage - Input Offset | 0.12µV | |
| Current - Supply | 930µA | |
| Current - Output / Channel | 17mA | |
| Voltage - Supply, Single/Dual (±) | 2.7 V ~ 5.25 V | |
| Operating Temperature | -40°C ~ 125°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) | |
| Supplier Device Package | 8-SOIC | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | LMP2011MA | |
| Related Links | LMP2, LMP2011MA Datasheet, Texas Instruments Distributor | |
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