NXP Semiconductors/Freescale Semiconductor, Inc. LPC1112FHN33/203,5

LPC1112FHN33/203,5 picture photo
Mfg. Part Number
LPC1112FHN33/203,5
Manufacturer
Product Category
Embedded - Microcontrollers
Brief Description
IC MCU 32BIT 16K 32HVQFN
Datasheet Download
LPC1112FHN33/203,5.pdf
Availability of LPC1112FHN33/203,5

Available Quantity

7029 Pieces

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Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
$ 1.16000
Our Price
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QUANTITY

 

EIS Components is the stocking Distributor of LPC1112FHN33/203,5, we specialize in NXP Semiconductors/Freescale Semiconductor, Inc. all series electronic components. LPC1112FHN33/203,5 can be shipped within 24 hours after order. If you have any demands for LPC1112FHN33/203,5, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
LPC1112FHN33/203,5 Order Process
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Specifications of LPC1112FHN33/203,5
Internal Part NumberEIS-LPC1112FHN33/203,5
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
Production Status (Lifecycle)In Production
ConditionNew & Unused, Original Sealed
Product Training ModulesCode Density for LPC11xx
Design ResourcesDevelopment Tool Selector
Standard Package260
Category Integrated Circuits (ICs)
FamilyEmbedded - Microcontrollers
SeriesLPC1100L
PackagingTray
Core ProcessorARM® Cortex®-M0
Core Size32-Bit
Speed50MHz
ConnectivityI²C, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, POR, WDT
Number of I/O28
Program Memory Size16KB (16K x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size4K x 8
Voltage - Supply (Vcc/Vdd)1.8 V ~ 3.6 V
Data ConvertersA/D 8x10b
Oscillator TypeInternal
Operating Temperature-40°C ~ 85°C
Package / Case32-VQFN Exposed Pad
Supplier Device Package32-HVQFN (7x7)
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)LPC1112FHN33/203,5
Related LinksLPC1112FH, LPC1112FHN33/203,5 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor
LPC1112FHN33/203,5 Details Description
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