Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-LS1024ASE7MLA | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | QorIQ LS1 Series Dual Core Application Processor | |
| Featured Product | QorIQ LS1 Communications Processors Built on Layerscape Architecture | |
| PCN Assembly/Origin | 17027 Site Chg 02/Dec/2015 | |
| Standard Package | 60 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microprocessors | |
| Series | QorlQ LS1 | |
| Packaging | Tray | |
| Core Processor | ARM® Cortex®-A9 | |
| Number of Cores/Bus Width | 2 Core, 32-Bit | |
| Speed | 1.2GHz | |
| Co-Processors/DSP | - | |
| RAM Controllers | DDR3 | |
| Graphics Acceleration | No | |
| Display & Interface Controllers | - | |
| Ethernet | GbE (3) | |
| SATA | SATA 3Gbps (2) | |
| USB | USB 2.0 + PHY (1), USB 3.0 + PHY | |
| Voltage - I/O | * | |
| Operating Temperature | * | |
| Security Features | Secure Boot, TrustZone® | |
| Package / Case | 625-BFBGA, FCBGA | |
| Supplier Device Package | 625-FCBGA (21x21) | |
| Additional Interfaces | I²C, I²S, SPI, UART | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | LS1024ASE7MLA | |
| Related Links | LS1024, LS1024ASE7MLA Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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