Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-LS1024ASE7MLA | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | QorIQ LS1 Series Dual Core Application Processor | |
Featured Product | QorIQ LS1 Communications Processors Built on Layerscape Architecture | |
PCN Assembly/Origin | 17027 Site Chg 02/Dec/2015 | |
Standard Package | 60 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microprocessors | |
Series | QorlQ LS1 | |
Packaging | Tray | |
Core Processor | ARM® Cortex®-A9 | |
Number of Cores/Bus Width | 2 Core, 32-Bit | |
Speed | 1.2GHz | |
Co-Processors/DSP | - | |
RAM Controllers | DDR3 | |
Graphics Acceleration | No | |
Display & Interface Controllers | - | |
Ethernet | GbE (3) | |
SATA | SATA 3Gbps (2) | |
USB | USB 2.0 + PHY (1), USB 3.0 + PHY | |
Voltage - I/O | * | |
Operating Temperature | * | |
Security Features | Secure Boot, TrustZone® | |
Package / Case | 625-BFBGA, FCBGA | |
Supplier Device Package | 625-FCBGA (21x21) | |
Additional Interfaces | I²C, I²S, SPI, UART | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | LS1024ASE7MLA | |
Related Links | LS1024, LS1024ASE7MLA Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor |
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