Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M1A3P1000-2FGG144I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 160 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 147456 | |
| Number of I/O | 97 | |
| Number of Gates | 1000000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 144-LBGA | |
| Supplier Device Package | 144-FPBGA (13x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M1A3P1000-2FGG144I | |
| Related Links | M1A3P1000, M1A3P1000-2FGG144I Datasheet, Microsemi SoC Distributor | |
![]() | 414373-4 | CONN BNC JACK R/A 50 OHM PCB | datasheet.pdf | |
![]() | 2002.2 | PARTITION ISO FOR TERMINAL BLOCK | datasheet.pdf | |
![]() | ERJ-1GNF4641C | RES SMD 4.64K OHM 1% 1/20W 0201 | datasheet.pdf | |
![]() | MCR01MRTJ474 | RES SMD 470K OHM 5% 1/16W 0402 | datasheet.pdf | |
![]() | RNC60H6341FSRE6 | RES 6.34K OHM 1/4W 1% AXIAL | datasheet.pdf | |
![]() | RER75F1960RCSL | RES CHAS MNT 196 OHM 1% 30W | datasheet.pdf | |
![]() | M39003/01-7080 | CAP TANT 12UF 5% 20V AXIAL | datasheet.pdf | |
![]() | NXFT15WF104FA1B140 | THERMISTOR NTC 100K OHM BEAD | datasheet.pdf | |
![]() | 2308-5211-TG | PIN STRIP HEADER 8 PIN RIGHT ANG | datasheet.pdf | |
![]() | 28-3508-20 | CONN IC DIP SOCKET 28POS GOLD | datasheet.pdf | |
![]() | CPCI-MV220 | CARD GUIDE VME 8.0" | datasheet.pdf | |
![]() | 1-1102271-8 | HB-Z.10.AG-ZVGR | datasheet.pdf |