Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M1A3P250-2FG144 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 160 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 36864 | |
| Number of I/O | 97 | |
| Number of Gates | 250000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 144-LBGA | |
| Supplier Device Package | 144-FPBGA (13x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M1A3P250-2FG144 | |
| Related Links | M1A3P25, M1A3P250-2FG144 Datasheet, Microsemi SoC Distributor | |
![]() | TM2REA-2408 | CONN MOD JACK 6P2C R/A UNSHLD | datasheet.pdf | |
![]() | H6MMS-1036G | DIP CABLE - HDM10S/AE10G/HDM10S | datasheet.pdf | |
![]() | SMBJ33CA-TP | TVS DIODE 33VWM 53.3VC SMB | datasheet.pdf | |
![]() | M29W160EB70ZA6E | IC FLASH 16MBIT 70NS 48TFBGA | datasheet.pdf | |
![]() | RNF14BTE2K10 | RES 2.1K OHM 1/4W .1% AXIAL | datasheet.pdf | |
![]() | PIC18LF23K22-I/SS | IC MCU 8BIT 8KB FLASH 28SSOP | datasheet.pdf | |
![]() | 940-1.140 | RND SPACER 0.063" NYLON 28.96MM | datasheet.pdf | |
![]() | CMF558K6600BEEB | RES 8.66K OHM 1/2W .1% AXIAL | datasheet.pdf | |
![]() | HSM6-12.7-65-2 | HEX STANDOFF M6 NYLON 65MM | datasheet.pdf | |
![]() | ATS-14D-203-C3-R0 | HEATSINK 54X54X10MM XCUT T412 | datasheet.pdf | |
![]() | UF318AAA23-H1C4A | IMPELLER 318X154MM 230VAC | datasheet.pdf | |
![]() | GRMB104K25C500 | Capacitors Inductors Filters... | datasheet.pdf |