Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M1A3P600-1FGG144 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 160 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 110592 | |
| Number of I/O | 97 | |
| Number of Gates | 600000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 144-LBGA | |
| Supplier Device Package | 144-FPBGA (13x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M1A3P600-1FGG144 | |
| Related Links | M1A3P600, M1A3P600-1FGG144 Datasheet, Microsemi SoC Distributor | |
![]() | 1733460000 | CONN TERM BLOCK DUAL DIN WM BG | datasheet.pdf | |
![]() | GBC17DRTF | CONN EDGECARD 34POS DIP .100 SLD | datasheet.pdf | |
![]() | ECC61DCSN-S288 | CONN EDGECARD 122POS .100 EXTEND | datasheet.pdf | |
![]() | G8P-1CTP DC5 | RELAY GEN PURPOSE SPDT 10A 5V | datasheet.pdf | |
![]() | MCR10EZPF1914 | RES SMD 1.91M OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | PRPC018SADN-RC | CONN HEADER .100" SNGL STR 18POS | datasheet.pdf | |
![]() | VI-24X-IU-F2 | CONVERTER MOD DC/DC 5.2V 200W | datasheet.pdf | |
![]() | R73UR2150SE00J | CAP FILM 0.015UF 5% 2KVDC RADIAL | datasheet.pdf | |
![]() | ITCSN-1500-48 | HEATSHRINK ITCSN | datasheet.pdf | |
![]() | 854-19222 | IE-MINIMC/TELCO-LFPT MODULE, TP- | datasheet.pdf | |
![]() | 850F200 | RES CHAS MNT 200 OHM 1% 50W | datasheet.pdf | |
![]() | HMC702LP6CETR | IC SYNTHESIZER W/SWEEPER 40-QFN | datasheet.pdf |