Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M1A3P600-2FG256 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 110592 | |
| Number of I/O | 177 | |
| Number of Gates | 600000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M1A3P600-2FG256 | |
| Related Links | M1A3P60, M1A3P600-2FG256 Datasheet, Microsemi SoC Distributor | |
![]() | 800-10-014-10-001000 | SIP HEADER 14 POS STRAIGHT PCB | datasheet.pdf | |
![]() | PIC18F4523-E/P | IC MCU 8BIT 32KB FLASH 40DIP | datasheet.pdf | |
![]() | 08053J0R5PBTTR | CAP THIN FILM 0.5PF 25V 0805 | datasheet.pdf | |
![]() | MJD3055G | TRANS NPN 60V 10A DPAK | datasheet.pdf | |
![]() | 12TW1-1A | SWITCH TOGGLE DPDT 5A 125V | datasheet.pdf | |
![]() | VS-30TPS08PBF | SCR PHASE CTRL 800V 30A TO247AC | datasheet.pdf | |
![]() | 0050579325 | CONN HSG 25POS .100 SINGLE VER D | datasheet.pdf | |
![]() | 3120-F301-N7Q1-W02D-20A | CIR BRKR THRM 20A 250VAC 50VDC | datasheet.pdf | |
![]() | MCR10ERTF2150 | RES SMD 215 OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | Y1691V0091VV9L | RES NETWORK 2 RES 500 OHM RADIAL | datasheet.pdf | |
![]() | ECC25DTAN | CONN EDGE DUAL .100 RA 50POS | datasheet.pdf | |
![]() | 93167-426HLF | HEADER BERGSTIK | datasheet.pdf |