Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M1A3P600L-FG484 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Gold to Palladium Coated Copper Wire Chg 5/Nov/2015 | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3L | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 110592 | |
| Number of I/O | 235 | |
| Number of Gates | 600000 | |
| Voltage - Supply | 1.14V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 484-BGA | |
| Supplier Device Package | 484-FPBGA (23x23) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M1A3P600L-FG484 | |
| Related Links | M1A3P60, M1A3P600L-FG484 Datasheet, Microsemi SoC Distributor | |
![]() | TX2SA-L-24V-X | RELAY TELECOM DPDT 2A 24V | datasheet.pdf | |
![]() | RG1608P-1023-B-T5 | RES SMD 102K OHM 0.1% 1/10W 0603 | datasheet.pdf | |
![]() | GBE45DHFN | CONN CARDEDGE 90POS 1MM SMD | datasheet.pdf | |
![]() | NCV8502D50G | IC REG LDO 5V 0.15A 8SOIC | datasheet.pdf | |
![]() | 3-644767-4 | CONN HEADER 4POS VERT .156 GOLD | datasheet.pdf | |
![]() | 3-1879471-2 | RES CHAS MNT 390 OHM 5% 300W | datasheet.pdf | |
![]() | P6KE350-G | TVS DIODE 284.2VWM 504VC DO15 | datasheet.pdf | |
![]() | 0901220924 | CONN HEADER DL R/A GOLD 8POS | datasheet.pdf | |
![]() | ATS-07B-43-C1-R0 | HEATSINK 25X25X10MM L-TAB | datasheet.pdf | |
![]() | DC685A | BOARD EVAL FOR LTC4059EDC | datasheet.pdf | |
![]() | 1-146460-2 | 12 MODII HDR SRST UNSHRD STKG | datasheet.pdf | |
![]() | VJ0805D3R9BXPAJ | CAP CER 3.9PF 250V NP0 0805 | datasheet.pdf |