Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M1AFS600-2FGG256 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | DDR Frequency 25/Jan/2013 | |
Standard Package | 90 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | Fusion® | |
Number of LABs/CLBs | - | |
Number of Logic Elements/Cells | - | |
Total RAM Bits | 110592 | |
Number of I/O | 119 | |
Number of Gates | 600000 | |
Voltage - Supply | 1.425 V ~ 1.575 V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C | |
Package / Case | 256-LBGA | |
Supplier Device Package | 256-FPBGA (17x17) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M1AFS600-2FGG256 | |
Related Links | M1AFS600, M1AFS600-2FGG256 Datasheet, Microsemi SoC Distributor |
![]() | 1212500000 | CONN BASE SIDE ENTRY SZ8 PG21 | datasheet.pdf | |
![]() | RG3216N-6340-P-T1 | RES SMD 634 OHM 0.02% 1/4W 1206 | datasheet.pdf | |
10320-C200-00 | CONN BACKSHELL 20POS 180DEG SHLD | datasheet.pdf | ||
![]() | B32521C6333J289 | CAP FILM 0.033UF 5% 400VDC RAD | datasheet.pdf | |
![]() | 1782R-67H | FIXED IND 91UH 84MA 8 OHM TH | datasheet.pdf | |
![]() | 6183400000100 | ADAPTERPLATTE 24 B/ 2XHAN 3A RAL | datasheet.pdf | |
![]() | LCAS4/0-12H-X | LUG COPPER 1 HOLE | datasheet.pdf | |
![]() | ATS-12A-78-C3-R0 | HEATSINK 25X25X35MM R-TAB T412 | datasheet.pdf | |
![]() | ATS-15B-110-C2-R1 | HEATSINK 54X40X12.7MM XCUT T766 | datasheet.pdf | |
![]() | DEMMD9PK | DSUB 9 M PCB R/A G50 ZINC | datasheet.pdf | |
![]() | MDM-51SH034L-A174 | MICRO 51C S 8" RBW JACKS NI | datasheet.pdf | |
![]() | MKP1840322135M | CAP FILM 0.022 UF 10% 1600VDC | datasheet.pdf |