Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M1AGL600V5-FGG144 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 160 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | IGLOO | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | 13824 | |
| Total RAM Bits | 110592 | |
| Number of I/O | 97 | |
| Number of Gates | 600000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 144-LBGA | |
| Supplier Device Package | 144-FPBGA (13x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M1AGL600V5-FGG144 | |
| Related Links | M1AGL600, M1AGL600V5-FGG144 Datasheet, Microsemi SoC Distributor | |
![]() | MHSL05040 | HEATSINK 2.39L X.45"H EXTRUSION | datasheet.pdf | |
![]() | RG2012N-2151-B-T1 | RES SMD 2.15K OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | CMF551M4000FHEB | RES 1.40M OHM 1/2W 1% AXIAL | datasheet.pdf | |
![]() | SN74AHC08PWRG4 | IC GATE AND 4CH 2-INP 14-TSSOP | datasheet.pdf | |
![]() | MAX8517EVKIT+ | KIT EVAL FOR MAX8517 | datasheet.pdf | |
![]() | GRM2196R2A8R1DD01D | CAP CER 8.1PF 100V R2H 0805 | datasheet.pdf | |
![]() | VI-J6J-EX-F1 | CONVERTER MOD DC/DC 36V 75W | datasheet.pdf | |
![]() | RPC0603JT200R | RES SMD 200 OHM 5% 1/10W 0603 | datasheet.pdf | |
![]() | GRM1555C1H330FA01D | CAP CER 33PF 50V NP0 0402 | datasheet.pdf | |
![]() | 62S11-M9-020C | OPTICAL ENCODER | datasheet.pdf | |
![]() | PVM-15 | FUSE MIDGET 15 A 600 DC PV | datasheet.pdf | |
![]() | XC4008E-PQ160 | IC FPGA 144 I/O 208QFP | datasheet.pdf |