Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M2GL005-FG484I | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
| Standard Package | 60 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | IGLOO2 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | 6060 | |
| Total RAM Bits | 719872 | |
| Number of I/O | 209 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 2.625 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 484-BGA | |
| Supplier Device Package | 484-FPBGA (23x23) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M2GL005-FG484I | |
| Related Links | M2GL005, M2GL005-FG484I Datasheet, Microsemi SoC Distributor | |
![]() | TL064ACD | IC OPAMP JFET 1MHZ 14SOIC | datasheet.pdf | |
![]() | TNPW0805511RBEEA | RES SMD 511 OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | B32231D6105K000 | CAP FILM 1UF 10% 400VDC AXIAL | datasheet.pdf | |
![]() | 3-406372-0 | INSERT RJ45 JACK TO IDC CONN | datasheet.pdf | |
![]() | MS27472E18A35PC | CONN RCPT 66POS WALL MNT W/PINS | datasheet.pdf | |
![]() | ACS02E-18-11PBX(003) | CONN RCPT 5POS BOX MNT W/PINS | datasheet.pdf | |
![]() | 4-1879521-4 | RES SMD 34.8K OHM 1% 1W 2010 | datasheet.pdf | |
![]() | 6013-036 | XFRMR LAMINATED 2.4VA THRU HOLE | datasheet.pdf | |
![]() | ATS-01G-126-C3-R0 | HEATSINK 54X54X15MM XCUT T412 | datasheet.pdf | |
![]() | ATS-08A-05-C3-R0 | HEATSINK 40X40X25MM XCUT T412 | datasheet.pdf | |
![]() | 8-653861-4 | SPRING, COMPRESSION | datasheet.pdf | |
![]() | TVS06RF-15-18HA-LC | TV 18C 18#20 PIN PLUG | datasheet.pdf |