Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2GL005-VF400 | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 90 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | IGLOO2 | |
Number of LABs/CLBs | - | |
Number of Logic Elements/Cells | 6060 | |
Total RAM Bits | 719872 | |
Number of I/O | 169 | |
Number of Gates | - | |
Voltage - Supply | 1.14 V ~ 2.625 V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C | |
Package / Case | 400-LFBGA | |
Supplier Device Package | 400-VFBGA (17x17) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2GL005-VF400 | |
Related Links | M2GL00, M2GL005-VF400 Datasheet, Microsemi SoC Distributor |
![]() | 595D106X9050R8T | CAP TANT 10UF 50V 10% 2824 | datasheet.pdf | |
![]() | RWR81S30R1BSRSL | RES 30.1 OHM 1W 0.1% WW AXIAL | datasheet.pdf | |
![]() | MCR10ERTF60R4 | RES SMD 60.4 OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | 28-C182-30 | CONN IC DIP SOCKET 28POS GOLD | datasheet.pdf | |
![]() | ATS-07F-205-C2-R0 | HEATSINK 60X60X6MM XCUT T766 | datasheet.pdf | |
![]() | L17H2430131 | D-Sub Connector Plug, Male Pins; Receptacle, Female Sockets 15, 15 Position Through Hole, Right Angle Solder | datasheet.pdf | |
![]() | VT-MIPM-135-D* | MIPM131 BASE | datasheet.pdf | |
![]() | 622EN233-6 | SEALED AERO SWITCH | datasheet.pdf | |
![]() | N-PA(40) | CONN ADAPT JACK-JACK NTYPE 50OHM | datasheet.pdf | |
![]() | 1376266-2 | M3 SOCKET EMBOSS ASSY 72P | datasheet.pdf | |
![]() | 1976200-3 | SECURE MOD PLUG TOOL & DIE 6-7 | datasheet.pdf | |
![]() | TV07RW-19-88P-P25AD | HD 38999 88C 88#23 PIN RECP | datasheet.pdf |