Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2GL005S-FGG484I | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 40 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | IGLOO2 | |
Number of LABs/CLBs | - | |
Number of Logic Elements/Cells | 6060 | |
Total RAM Bits | 719872 | |
Number of I/O | 209 | |
Number of Gates | - | |
Voltage - Supply | 1.14 V ~ 2.625 V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 484-BGA | |
Supplier Device Package | 484-FBGA (23x23) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2GL005S-FGG484I | |
Related Links | M2GL005S, M2GL005S-FGG484I Datasheet, Microsemi SoC Distributor |
![]() | 5621 | FIXED IND 250UH 6.4A 59 MOHM TH | datasheet.pdf | |
![]() | 06035A100KAJ2A | CAP CER 10PF 50V NP0 0603 | datasheet.pdf | |
![]() | CRCW06038R25FKEAHP | RES SMD 8.25 OHM 1% 1/4W 0603 | datasheet.pdf | |
![]() | 5532232801F | LED CBI 3MM BI-LVL YLW/GRN TINT | datasheet.pdf | |
![]() | 892-70-034-20-001101 | CONN HDR 34POS 2.54MM T/H R/A | datasheet.pdf | |
![]() | 91615-404LF | DUBOX | datasheet.pdf | |
![]() | EBC08DRMI | CONN EDGECARD 16POS .100" | datasheet.pdf | |
![]() | ATS-12F-133-C2-R0 | HEATSINK 70X70X10MM XCUT T766 | datasheet.pdf | |
![]() | ATS-02H-13-C2-R0 | HEATSINK 50X50X15MM XCUT T766 | datasheet.pdf | |
![]() | 413-L11-FN2-1364-30A | CIR BRKR THRM 30A | datasheet.pdf | |
![]() | 202E346-50-0-CS5324 | BLOW-MOLDED PARTS | datasheet.pdf | |
![]() | TV07DZ-17-99PA | TV 23C 21#20 2#16 PIN J/N RECP | datasheet.pdf |