Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M2GL010-1VF256I | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
| Standard Package | 119 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | IGLOO2 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | 12084 | |
| Total RAM Bits | 933888 | |
| Number of I/O | 148 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 2.625 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 256-LFBGA | |
| Supplier Device Package | 256-BGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M2GL010-1VF256I | |
| Related Links | M2GL010, M2GL010-1VF256I Datasheet, Microsemi SoC Distributor | |
![]() | 9T06031A5600CAHFT | RES SMD 560 OHM 0.25% 1/10W 0603 | datasheet.pdf | |
![]() | TEH70P1K50JE | RES 1.5K OHM 70W 5% TO247 | datasheet.pdf | |
![]() | KZE25VB331M10X12LL | CAP ALUM 330UF 20% 25V RADIAL | datasheet.pdf | |
![]() | PBL38640/2QNT | IC LINE INTERFACE SLIC PLCC-28 | datasheet.pdf | |
![]() | EB65-P0E3530X | CONN EDGEBOARD DUAL 70POS 3A | datasheet.pdf | |
![]() | PFS35-36RF1 | RES SMD 36 OHM 1% 35W TO263 DPAK | datasheet.pdf | |
![]() | CA3100R28-12PXBF80F0 | CONN HSG WALL MNT RCPT 26POS | datasheet.pdf | |
![]() | M1AGL1000V5-FGG484I | IC FPGA 300 I/O 484FBGA | datasheet.pdf | |
![]() | M39003/01-3032/HSD | CAP TANT 47UF 20% 35V AXIAL | datasheet.pdf | |
![]() | H605208000J0G | 1000 TB SPR CLA R/HOLE | datasheet.pdf | |
![]() | ASTMLPFL-18-24.000MHZ-EJ-E-T | OSC MEMS 24MHZ H/LV CMOS SMD | datasheet.pdf | |
![]() | DDC50S | DSUB 50 F CRIMP G ZINC | datasheet.pdf |