Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M2GL010-1VFG256 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
| Standard Package | 119 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | IGLOO2 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | 12084 | |
| Total RAM Bits | 933888 | |
| Number of I/O | 148 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 2.625 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M2GL010-1VFG256 | |
| Related Links | M2GL010, M2GL010-1VFG256 Datasheet, Microsemi SoC Distributor | |
![]() | 0224003.MXP | FUSE GLASS 3A 250VAC 125VDC 2AG | datasheet.pdf | |
![]() | MCR10EZPJ180 | RES SMD 18 OHM 5% 1/8W 0805 | datasheet.pdf | |
![]() | RG1608P-1241-W-T5 | RES SMD 1.24K OHM 1/10W 0603 | datasheet.pdf | |
![]() | 357-022-532-102 | CARDEDGE 22POS .156 BLACK LO PRO | datasheet.pdf | |
![]() | ASM11DSEI-S13 | CONN EDGECARD 22POS .156 EXTEND | datasheet.pdf | |
![]() | 75168-102-04 | HDR RA SR.100 GP | datasheet.pdf | |
![]() | 2-284512-4 | TERM BLOCK HDR 24POS R/A 3.5MM | datasheet.pdf | |
![]() | STK14D88-NF45TR | IC NVSRAM 256KBIT 45NS 32SOIC | datasheet.pdf | |
![]() | C146 21R010 805 8 | CONN HOOD CPLNG BOTTOM SZE10 M40 | datasheet.pdf | |
![]() | 1095610000 | CONN TERM BLOCK R/A 3POS 7.62MM | datasheet.pdf | |
![]() | 8N4SV75BC-0156CDI8 | IC OSC VCXO 121.109MHZ 6-CLCC | datasheet.pdf | |
![]() | GRM3195C2A472FA01D | Capacitors Inductors Filters... | datasheet.pdf |