Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M2GL050-1FG896I | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
| Standard Package | 27 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | IGLOO2 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | 56340 | |
| Total RAM Bits | 1869824 | |
| Number of I/O | 377 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 2.625 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 896-BGA | |
| Supplier Device Package | 896-FBGA (31x31) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M2GL050-1FG896I | |
| Related Links | M2GL050, M2GL050-1FG896I Datasheet, Microsemi SoC Distributor | |
![]() | WSL2512R0200FEA | RES SMD 0.02 OHM 1% 1W 2512 | datasheet.pdf | |
![]() | 06200.61.06 | CRD EXTEN 3COND 100' FROG HIDE | datasheet.pdf | |
![]() | MMBD4148CC-TP | DIODE ARRAY GP 75V 200MA SOT23 | datasheet.pdf | |
| 293770-000 | HEATSHRINK MOLDED Y BOOT EPB ADH | datasheet.pdf | ||
![]() | TXR54AB45-1005AI | CONN BACKSHELL ADPT SZ 10-10SL | datasheet.pdf | |
![]() | DL60R18-31P6-6106-LC | CONN HSG RCPT FLANGE 31POS PIN | datasheet.pdf | |
![]() | CMF554M4200FKRE | RES 4.42M OHM 1/2W 1% AXIAL | datasheet.pdf | |
![]() | FGG.2B.306.ZLA | INSERT FGG.2B.306. FOR 6LV | datasheet.pdf | |
![]() | E74D500HPN882UA67Q | CAP ALUM 8800UF 50V SCREW | datasheet.pdf | |
![]() | ATS-14F-30-C1-R0 | HEATSINK 70X70X25MM XCUT | datasheet.pdf | |
![]() | 2200/16GR-100 | HOOK-UP STRND 600V 16AWG GRN | datasheet.pdf | |
![]() | SIT9001AC-2-25S2 | OSC MEMS PROG 3.2X2.5MM 2.5V | datasheet.pdf |