Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M2GL050-1FGG896I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
| Standard Package | 27 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | IGLOO2 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | 56340 | |
| Total RAM Bits | 1869824 | |
| Number of I/O | 377 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 2.625 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 896-BGA | |
| Supplier Device Package | 896-FBGA (31x31) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M2GL050-1FGG896I | |
| Related Links | M2GL050-, M2GL050-1FGG896I Datasheet, Microsemi SoC Distributor | |
![]() | 52435-2672 | CONN FFC TOP 26POS 0.50MM R/A | datasheet.pdf | |
![]() | RG2012P-53R6-B-T1 | RES SMD 53.6 OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | RBC13DCMI | CONN EDGECARD 26POS .100 EXTEND | datasheet.pdf | |
![]() | 68691-672 | BERGSTIK II .100" DR STRAIGHT | datasheet.pdf | |
![]() | RNCF1206BKE59K0 | RES SMD 59K OHM 0.1% 1/4W 1206 | datasheet.pdf | |
![]() | FN2700074 | OSCILLATOR XO 27.000MHZ CMOS SMD | datasheet.pdf | |
![]() | VE-25M-MX | CONVERTER MOD DC/DC 10V 75W | datasheet.pdf | |
![]() | B43510A6477M7 | CAP ALUM 470UF 20% 500V SNAP | datasheet.pdf | |
![]() | 61500295896 | DURABLE FLEX BELT 1/4X24" A FIN | datasheet.pdf | |
![]() | C146 10F064 602 2 | CONN BASE SIDE ENTRY SZE24 PG29 | datasheet.pdf | |
![]() | EKMT451VSN121MP35S | CAP ALUM 120UF 20% 450V SNAP | datasheet.pdf | |
![]() | 95J2R7E | RES 2.7 OHM 5W 5% AXIAL | datasheet.pdf |