Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M2GL050-FGG896I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
| Standard Package | 60 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | IGLOO2 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | 56340 | |
| Total RAM Bits | 1869824 | |
| Number of I/O | 377 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 2.625 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 896-BGA | |
| Supplier Device Package | 896-FBGA (31x31) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M2GL050-FGG896I | |
| Related Links | M2GL050, M2GL050-FGG896I Datasheet, Microsemi SoC Distributor | |
![]() | A2MXS-4018G | ADM40S/AE40G/X | datasheet.pdf | |
![]() | DF9B-9P-1V(32) | CONN HEADER 9POS 1MM SMD TIN | datasheet.pdf | |
![]() | EBM24DRTS | CONN EDGECARD 48POS DIP .156 SLD | datasheet.pdf | |
![]() | RNCF0805BKE499R | RES SMD 499 OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | GRM31A7U2E562JW31D | CAP CER 5600PF 250V U2J 1206 | datasheet.pdf | |
![]() | TNPU08054K64AZEN00 | RES SMD 4.64KOHM 0.05% 1/8W 0805 | datasheet.pdf | |
![]() | RNC60H1651DSRE6 | RES 1.65K OHM 1/4W .5% AXIAL | datasheet.pdf | |
![]() | NPX-SPI-701T | SENSOR PRES 14.5 - 101.5PSI ABS | datasheet.pdf | |
![]() | SS3P5HM3/85A | DIODE SCHOTTKY 50V 3A DO220AA | datasheet.pdf | |
![]() | BACC63CU25-8SAH | CONN RCPT 8POS SQ FLNG WO/SCKT | datasheet.pdf | |
![]() | ATS-P2-141-C1-R0 | HEATSINK 30X30X10MM L-TAB | datasheet.pdf | |
![]() | ATS-06D-39-C2-R0 | HEATSINK 57.9X60.96X5.84MM T766 | datasheet.pdf |