Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M2GL060-1VFG400 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | IGLOO2 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | 56520 | |
| Total RAM Bits | 1869824 | |
| Number of I/O | 207 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 2.625 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 400-LFBGA | |
| Supplier Device Package | 400-VFBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M2GL060-1VFG400 | |
| Related Links | M2GL060, M2GL060-1VFG400 Datasheet, Microsemi SoC Distributor | |
![]() | ERJ-M1WSF16MU | RES SMD 0.016 OHM 1% 1W 2512 | datasheet.pdf | |
![]() | MT4HTF3264HY-667B3 | MODULE SDRAM DDR2 256MB 200SODIM | datasheet.pdf | |
![]() | RSA50DTAT | CONN EDGECARD 100PS R/A .125 SLD | datasheet.pdf | |
![]() | VE-2TZ-MV-F3 | CONVERTER MOD DC/DC 2V 60W | datasheet.pdf | |
![]() | CDR32BP120BKZRAT | CAP CER 12PF 100V 10% BP 1206 | datasheet.pdf | |
![]() | DTS26F11-35SN | CONN PLUG 13POS STRGHT W/SKT | datasheet.pdf | |
![]() | TNM10-25-85-2 | ROUND STANDOFF M10 NYLON 85MM | datasheet.pdf | |
![]() | KTR03EZPF8203 | RES SMD 820K OHM 1% 1/10W 0603 | datasheet.pdf | |
![]() | EBC06DTAI | CONN EDGECARD 12POS .100" | datasheet.pdf | |
![]() | ATS-14C-23-C3-R0 | HEATSINK 60X60X15MM XCUT T412 | datasheet.pdf | |
![]() | UMJ316BB7474KLHT | CAP CER 0.47UF 50V X7R 1206 | datasheet.pdf | |
![]() | 2-1907429-0 | FO C/A MTRJ SC XG AQU | datasheet.pdf |