Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2GL150-1FCV484 | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 84 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | IGLOO2 | |
Number of LABs/CLBs | - | |
Number of Logic Elements/Cells | 146124 | |
Total RAM Bits | 5120000 | |
Number of I/O | 248 | |
Number of Gates | - | |
Voltage - Supply | 1.14 V ~ 2.625 V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C | |
Package / Case | 484-BFBGA | |
Supplier Device Package | 484-BGA | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2GL150-1FCV484 | |
Related Links | M2GL150, M2GL150-1FCV484 Datasheet, Microsemi SoC Distributor |
![]() | 172-015-182-001 | D-Sub Connector Plug, Male Pins 15 Position Through Hole Solder | datasheet.pdf | |
CDEP134NP-3R6MC | FIXED IND 3.6UH 8A 10.8 MOHM SMD | datasheet.pdf | ||
![]() | GSC26DRYN-S93 | CONN EDGECARD 52POS DIP .100 SLD | datasheet.pdf | |
![]() | ECQ-V1394JM9 | CAP FILM 0.39UF 5% 100VDC RADIAL | datasheet.pdf | |
![]() | 123C10019X | HIGH POWER CONTACTS SOLDER PIN | datasheet.pdf | |
![]() | RER75F22R1MC02 | RES CHAS MNT 22.1 OHM 1% 30W | datasheet.pdf | |
![]() | 801-83-003-10-458101 | Connector Socket 3 Position 0.200" (5.08mm) Gold Through Hole | datasheet.pdf | |
![]() | ATS-04D-69-C1-R0 | HEATSINK 45X45X20MM L-TAB | datasheet.pdf | |
![]() | MQ1238E48B-FSR | FAN AXIAL 120X38MM 48VDC | datasheet.pdf | |
![]() | D38999/20MJ37PB | CTV 39C 39#16 PIN RECP | datasheet.pdf | |
![]() | TVPS00RK-11-98AB | TV 6C 6#20 PIN RECP | datasheet.pdf | |
![]() | LDH65100PAAA-4 | Capacitors Inductors Filters... | datasheet.pdf |