Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M2S005-TQG144 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
| Standard Package | 60 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - System On Chip (SoC) | |
| Series | SmartFusion®2 | |
| Packaging | Tray | |
| Architecture | MCU, FPGA | |
| Core Processor | ARM® Cortex®-M3 | |
| MCU Flash | 128KB | |
| MCU RAM | 64KB | |
| Peripherals | DDR, PCIe, SERDES | |
| Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
| Speed | 166MHz | |
| Primary Attributes | FPGA - 5K Logic Modules | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 144-LQFP | |
| Supplier Device Package | 144-TQFP (20x20) | |
| Number of I/O | 84 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M2S005-TQG144 | |
| Related Links | M2S005, M2S005-TQG144 Datasheet, Microsemi SoC Distributor | |
![]() | 9T12062A1150CAHFT | RES SMD 115 OHM 0.25% 1/8W 1206 | datasheet.pdf | |
![]() | RT0603BRE0731K6L | RES SMD 31.6KOHM 0.1% 1/10W 0603 | datasheet.pdf | |
![]() | 4310R-101-203LF | RES ARRAY 9 RES 20K OHM 10SIP | datasheet.pdf | |
![]() | NCP301HSN18T1G | IC VOLT DETECT OD 1.8V 5TSOP | datasheet.pdf | |
![]() | 2-282812-1 | TERM BLOCK HDR 21POS R/A 5MM | datasheet.pdf | |
![]() | NHQM474B435T5 | THERMISTOR NTC 470K OHM 5% 0805 | datasheet.pdf | |
![]() | 1-928038-2 | 2X3P MT TAND BU-GEH | datasheet.pdf | |
![]() | VI-B3N-MY-F4 | CONVERTER MOD DC/DC 18.5V 50W | datasheet.pdf | |
![]() | ATS-03G-145-C2-R0 | HEATSINK 30X30X30MM L-TAB T766 | datasheet.pdf | |
![]() | 643020 | LOCATOR MINI STATIC | datasheet.pdf | |
![]() | TX18AB90-2420 | CONN BACKSHELL ADPT SZ 24 OLIVE | datasheet.pdf |