Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2S010T-1FGG484 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 60 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Series | SmartFusion®2 | |
Packaging | Tray | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 256KB | |
MCU RAM | 64KB | |
Peripherals | DDR, PCIe, SERDES | |
Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
Speed | 166MHz | |
Primary Attributes | FPGA - 10K Logic Modules | |
Operating Temperature | 0°C ~ 85°C | |
Package / Case | 484-BGA | |
Supplier Device Package | 484-FPBGA (23x23) | |
Number of I/O | 233 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2S010T-1FGG484 | |
Related Links | M2S010T, M2S010T-1FGG484 Datasheet, Microsemi SoC Distributor |
![]() | AXN326C238S | CONN SOCKET .8MM 26POS SMD | datasheet.pdf | |
![]() | T95S334M035EZSL | CAP TANT 0.33UF 35V 20% 1507 | datasheet.pdf | |
![]() | RNC55H4482FSB14 | RES 44.8K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | MAX1870AETJ+ | IC BATT CHRGR LI+ 32TQFN | datasheet.pdf | |
![]() | PNEV512B,699 | BOARD EVAL NFC PN512 VER.B | datasheet.pdf | |
96702100 | BOCUBE B FP 1008 FRNT PNL 1.5MM | datasheet.pdf | ||
![]() | LMD-7101-P | DIODE MODULE 4 DISCRETE DIODES | datasheet.pdf | |
![]() | ATS-19G-37-C3-R0 | HEATSINK 36.83X57.6X17.78MM T412 | datasheet.pdf | |
![]() | CS3102A-48-53P | CONN RCPT 37POS BOX MNT PIN | datasheet.pdf | |
![]() | YQ42015000J0G | 350 TB RISING CLAMP LEFT | datasheet.pdf | |
![]() | C2012NP02W821J060AA | CAP CER 820PF 450V NP0 0805 | datasheet.pdf | |
![]() | NS20 | FUSE 20A 440V AC BS88 | datasheet.pdf |