Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2S010TS-1FG484M | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 40 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Series | SmartFusion®2 | |
Packaging | Tray | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 256KB | |
MCU RAM | 64KB | |
Peripherals | DDR, PCIe, SERDES | |
Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
Speed | 166MHz | |
Primary Attributes | FPGA - 10K Logic Modules | |
Operating Temperature | -55°C ~ 125°C | |
Package / Case | 484-BGA | |
Supplier Device Package | 484-FPBGA (23x23) | |
Number of I/O | 233 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2S010TS-1FG484M | |
Related Links | M2S010TS, M2S010TS-1FG484M Datasheet, Microsemi SoC Distributor |
![]() | MM5Z5V6ST1G | DIODE ZENER 5.61V 500MW SOD523 | datasheet.pdf | |
![]() | EP1C4F324C6 | IC FPGA 249 I/O 324FBGA | datasheet.pdf | |
![]() | X9400WV24IZ | IC XDCP QUAD 64-TAP 10K 24-TSSOP | datasheet.pdf | |
![]() | ISL61852EVAL1Z | EVAL BOARD FOR ISL61852 | datasheet.pdf | |
![]() | SCRH104-4R7 | FIXED IND 4.7UH 4.22A 32 MOHM | datasheet.pdf | |
![]() | MCA12060D1691BP100 | RES SMD 1.69K OHM 0.1% 1/4W 1206 | datasheet.pdf | |
![]() | RWR81S1180FSS70 | RES 118 OHM 1W 1% WW AXIAL | datasheet.pdf | |
![]() | AFD57-24-31PX-6141 | CONN HSG PLUG STRGHT 31POS PIN | datasheet.pdf | |
![]() | 1357840000 | TERM BLOCK HDR 24POS R/A 3.5MM | datasheet.pdf | |
![]() | 3450G00980196 | CERAMIC MANUAL RESET THERMOSTAT | datasheet.pdf | |
![]() | ATS-03A-188-C1-R0 | HEATSINK 45X45X15MM R-TAB | datasheet.pdf | |
![]() | 260A49-15 | TERM BLOCK COVER | datasheet.pdf |