Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2S025TS-1FG484I | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 60 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Series | SmartFusion®2 | |
Packaging | Tray | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 256KB | |
MCU RAM | 64KB | |
Peripherals | DDR, PCIe, SERDES | |
Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
Speed | 166MHz | |
Primary Attributes | FPGA - 25K Logic Modules | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 484-BGA | |
Supplier Device Package | 484-FPBGA (23x23) | |
Number of I/O | 267 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2S025TS-1FG484I | |
Related Links | M2S025TS, M2S025TS-1FG484I Datasheet, Microsemi SoC Distributor |
PZC29SADN | CONN HEADER .100 SINGL STR 29POS | datasheet.pdf | ||
IRLR120NPBF | MOSFET N-CH 100V 10A DPAK | datasheet.pdf | ||
CP0005560R0JB14 | RES 560 OHM 5% 5W MET OXIDE AXL | datasheet.pdf | ||
RT0603DRE07232KL | RES SMD 232K OHM 0.5% 1/10W 0603 | datasheet.pdf | ||
RNF14FTD4K87 | RES 4.87K OHM 1/4W 1% AXIAL | datasheet.pdf | ||
SM2615FT82R5 | RES SMD 82.5 OHM 1% 1W 2615 | datasheet.pdf | ||
315000010277 | HERMETIC THERMOSTAT | datasheet.pdf | ||
7211L42H3CQE22 | SWITCH TOGGLE SP3T 5A 120V | datasheet.pdf | ||
ATS-01A-26-C1-R0 | HEATSINK 70X70X10MM XCUT | datasheet.pdf | ||
EC7250-000 | HSI NARROW | datasheet.pdf | ||
BACC63BP18H31P8H | 26500 31C 31#20 P PLUG AN LC | datasheet.pdf | ||
ADSP-2100A | ADSP-2100 Family DSP Microcomputers IC | datasheet.pdf |