Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2S060-1FGG676I | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 40 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Series | SmartFusion®2 | |
Packaging | Tray | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 256KB | |
MCU RAM | 64KB | |
Peripherals | DDR, PCIe, SERDES | |
Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
Speed | 166MHz | |
Primary Attributes | FPGA - 60K Logic Modules | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 676-BGA | |
Supplier Device Package | 676-FBGA (27x27) | |
Number of I/O | 387 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2S060-1FGG676I | |
Related Links | M2S060-, M2S060-1FGG676I Datasheet, Microsemi SoC Distributor |
![]() | VJ2220Y224JBCAT4X | CAP CER 0.22UF 200V X7R 2220 | datasheet.pdf | |
![]() | CRCW04021R96FKED | RES SMD 1.96 OHM 1% 1/16W 0402 | datasheet.pdf | |
![]() | ERJ-1GNF38R3C | RES SMD 38.3 OHM 1% 1/20W 0201 | datasheet.pdf | |
![]() | 1017750000 | TERM BLOCK PLUG 9POS STR 5MM | datasheet.pdf | |
![]() | 214A311-25-0 | BOOT MOLDED | datasheet.pdf | |
![]() | SCE016XD2CTB | BUZZ PIEZO CIRC 42.85MM PANEL | datasheet.pdf | |
![]() | 4616-7305 | WIREMOUNT PLUG 16 CONTACT CLSD E | datasheet.pdf | |
![]() | T0058735869 | PIPE RIGHT ANGLE .2MX75MM WFE20D | datasheet.pdf | |
![]() | ASG2-D-X-B-698.812334MHZ | OSC XO 698.812334MHZ LVDS SMD | datasheet.pdf | |
![]() | TS600T23IET | CRYSTAL 60.000000 MHZ | datasheet.pdf | |
![]() | R5F10EGCGFB#V0 | IC MCU 16BIT 32KB FLASH | datasheet.pdf | |
![]() | MS27467T9B98P-USB1 | CONN HSG PLUG STRGHT 3POS PIN | datasheet.pdf |