Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2S060-1FGG676I | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 40 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Series | SmartFusion®2 | |
Packaging | Tray | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 256KB | |
MCU RAM | 64KB | |
Peripherals | DDR, PCIe, SERDES | |
Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
Speed | 166MHz | |
Primary Attributes | FPGA - 60K Logic Modules | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 676-BGA | |
Supplier Device Package | 676-FBGA (27x27) | |
Number of I/O | 387 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2S060-1FGG676I | |
Related Links | M2S060-, M2S060-1FGG676I Datasheet, Microsemi SoC Distributor |
![]() | LD2982BM15R | IC REG LDO 1.5V 50MA SOT23-5 | datasheet.pdf | |
![]() | HLMP-CM37-X1BZZ | LED GREEN CLEAR 5MM ROUND T/H | datasheet.pdf | |
![]() | GCM08DRMN | CONN EDGECARD 16POS .156 WW | datasheet.pdf | |
![]() | 12063C104MAT2T | CAP CER 0.1UF 25V X7R 1206 | datasheet.pdf | |
![]() | P300K-E3/54 | DIODE GEN PURP 800V 3A DO201AD | datasheet.pdf | |
![]() | 8-1623772-1 | RES 1.50K OHM 7W 5% AXIAL | datasheet.pdf | |
![]() | 325133-24-0 | Connector Barrier Block Strip 24 Circuit 0.325" (8.26mm) | datasheet.pdf | |
![]() | 0982680721 | 1.25MM JMPR LGT 305 TYPE A 4POS | datasheet.pdf | |
![]() | B43508E2188M87 | CAP ALUM 1800UF 20% 250V SNAP | datasheet.pdf | |
![]() | GSEA41S2 | GSS SAFETY LIMIT SW 3NC/1NO | datasheet.pdf | |
![]() | MDM-51SHC42B-A174 | MICRO 51C S 120" WHT NI | datasheet.pdf | |
![]() | 20021832-04510T1LF | 1.27 BTB STK VT SMT | datasheet.pdf |