Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2S060TS-FGG676 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 40 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Series | SmartFusion®2 | |
Packaging | Tray | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 256KB | |
MCU RAM | 64KB | |
Peripherals | DDR, PCIe, SERDES | |
Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
Speed | 166MHz | |
Primary Attributes | FPGA - 60K Logic Modules | |
Operating Temperature | 0°C ~ 85°C | |
Package / Case | 676-BGA | |
Supplier Device Package | 676-FBGA (27x27) | |
Number of I/O | 387 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2S060TS-FGG676 | |
Related Links | M2S060T, M2S060TS-FGG676 Datasheet, Microsemi SoC Distributor |
![]() | 74ACTQ16373MTDX | IC LATCH TRANSP 16BIT 48TSSOP | datasheet.pdf | |
![]() | RT0805DRE07196RL | RES SMD 196 OHM 0.5% 1/8W 0805 | datasheet.pdf | |
![]() | 5419 GOLD1/4 IN X 36 YD | TAPE LOW STATIC POLYIMIDE FILM | datasheet.pdf | |
![]() | RN65C5362FBSL | RES 53.6K OHM 1/2W 1% AXIAL | datasheet.pdf | |
![]() | 24563144 | SUBRACK FOR 19" 3U 84HP 355MM | datasheet.pdf | |
![]() | 10116693-JCB65LF | CFQ-7800 | datasheet.pdf | |
![]() | YB216CWCKW01-5F12-JB | SWITCH PUSHBUTTON SPDT 3A 125V | datasheet.pdf | |
![]() | ATS-02D-18-C2-R0 | HEATSINK 54X54X15MM XCUT T766 | datasheet.pdf | |
![]() | 770876-1 | 09P MINI UMNL HDR ASSY SN | datasheet.pdf | |
![]() | 67-BFS-060-4-12 | EMI FILTER | datasheet.pdf | |
![]() | MS27474T14F35SB-LC | JT 37C 37#22D SKT RECP | datasheet.pdf | |
![]() | 610D685F100DR5 | 6.8UF 100V 9.53X69.85 125C AXI | datasheet.pdf |