Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2S090T-FGG676I | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 60 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Series | SmartFusion®2 | |
Packaging | Tray | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 512KB | |
MCU RAM | 64KB | |
Peripherals | DDR, PCIe, SERDES | |
Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
Speed | 166MHz | |
Primary Attributes | FPGA - 90K Logic Modules | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 676-BGA | |
Supplier Device Package | 676-FBGA (27x27) | |
Number of I/O | 425 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2S090T-FGG676I | |
Related Links | M2S090T, M2S090T-FGG676I Datasheet, Microsemi SoC Distributor |
![]() | TM18RA-FT-62 | CONN MOD JACK 6P2C R/A UNSHLD | datasheet.pdf | |
![]() | FXO-HC735-16.667 | OSC XO 16.667MHZ HCMOS SMD | datasheet.pdf | |
![]() | XR17V254IV-F | IC UART PCI BUS QUAD 144LQFP | datasheet.pdf | |
![]() | ISC1812RQR12M | FIXED IND 120NH 519MA 260 MOHM | datasheet.pdf | |
![]() | RPC0805JT2K70 | RES SMD 2.7K OHM 5% 1/4W 0805 | datasheet.pdf | |
![]() | .1MIC 3M668X PSA DISC 8 | DIAMOND LAPPING FILM 668X | datasheet.pdf | |
![]() | RPP30-2412S-F | 30W DC/DC-CONV POWERLINE-PLUS | datasheet.pdf | |
![]() | 83278618 | SWITCH SNAP ACTION 0.05A SPST | datasheet.pdf | |
![]() | TA205PA7R50J | RES 7.5 OHM 5W 5% RADIAL | datasheet.pdf | |
![]() | MS4800B-20-0920-X | TRANSMITTER SAFETY LIGHT CURTAIN | datasheet.pdf | |
![]() | SIT9002AC-08N25ST | OSC MEMS PROG | datasheet.pdf | |
![]() | ACS05E18-10S-023 | AC 4C 4#12 SKT PLUG 023 | datasheet.pdf |